Back Encapsulat dels circuits integrats Catalan Aufbau- und Verbindungstechnik German بسته‌بندی مدار مجتمع Persian Encapsulation (électronique) French Pengemasan sirkuit terpadu ID パッケージ (電子部品) Japanese Корпусирование интегральных схем Russian Корпусування мікросхем Ukrainian 集成电路封装 Chinese

Integrated circuit packaging

This article is about the final stage in the manufacturing process of integrated circuits. For an article about the physical enclosure that surrounds integrated circuits, see Semiconductor package.

Cross section of a dual in-line package. This type of package houses a small semiconducting die, with microscopic wires attaching the die to the lead frames, allowing for electrical connections to be made to a PCB.
Dual in-line (DIP) integrated circuit metal lead frame tape with contacts

Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

The packaging stage is followed by testing of the integrated circuit.

From Wikipedia, the free encyclopedia · View on Wikipedia

Developed by Tubidy