Back Encapsulat de semiconductor Catalan Pouzdro polovodičové součástky Czech Hus (halvleder) Danish Chipgehäuse German Kiibikorpus Estonian Boîtier de circuit intégré French Kemasan semikonduktor ID Package (elettronica) Italian Encapsulamento de circuitos integrados Portuguese قرصی حامل Urdu
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A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.